Copper Foil Daim kab xev ntau lawm txheej txheem

Dec 26, 2025 Tso lus

Hauv kev lag luam hluav taws xob, kev sib txuas lus thev naus laus zis, thiab kev tsim khoom lag luam, cov ntawv xov tooj tooj liab, yog ib qho tseem ceeb ntawm ntau yam -cov khoom siv sib xyaw ua ke, tau dhau los ua ib qho ntawm cov ntaub ntawv tseem ceeb rau kev tsim hluav taws xob, EMI / EMC kev kho mob, thiab kev tswj xyuas thermal vim nws cov conductivity zoo heev, electromagnetic shielding kev ua tau zoo, thiab yooj yim ntawm kev ua.

Copper Foil Daim kab xev Cov yam ntxwv:

Kev ua tau zoo heev: Volume resistivity tuaj yeem qis li 0.015-0.05 Ω / cm², kom ntseeg tau tias kev sib kis tau zoo tam sim no thiab hauv av.

Superior Electromagnetic Shielding Effectiveness (SE): Kev tiv thaiv kev ua tau zoo tuaj yeem ncav cuag 60-100 dB nyob rau hauv 30 MHz - 1 GHz zaus ntau yam, muaj txiaj ntsig zoo tiv thaiv electromagnetic cuam tshuam (EMI) thiab xov tooj cua cuam tshuam (RFI).

Kev Thermal Conductivity thiab Thermal Management Capabilities: Cov ntshiab tooj liab substrate muaj cov thermal conductivity txog li 398 W / (m·K), feem ntau yog siv rau cov cua sov dissipation pab.

Zoo Flexibility: Yooj yim rau tuag- txiav thiab khoov, ua raws li ntau qhov chaw tsis sib xws.

Core Application Scenarios: Los ntawm Electronics Manufacturing mus rau Txiav -Edge Technology

PCB thiab Circuit Court Design: Siv rau Circuit Board jumpers, grounding, shielding, ib ntus Circuit Court kho, thiab tiv thaiv tiv thaiv.

EMI / EMC Electromagnetic Shielding: Siv rau cov khoom siv hluav taws xob cov khoom siv hluav taws xob, cov khoom siv hluav taws xob, thiab cov lus qhia tom qab kom ua tau zoo ntawm electromagnetic to thiab ua tau raws li FCC, CE, thiab lwm yam yuav tsum tau ntawv pov thawj.

Lithium-Ion Battery Manufacturing: Siv rau kev sib txuas ntawm roj teeb tab, cell wrapping insulatio, n thiab shielding, yuav tsum tau daim kab xev kom muaj siab purity thiab tiv thaiv electrolytes.

Thermal Management Modules: Siv nruab nrab ntawm cov khoom siv cua sov thiab cov dab dej kub kom sau cov khoob thiab txhim kho cov cua sov kom zoo.

Lub Tsev thiab Pipeline Engineering: Siv los tiv thaiv- cov av zoo li qub, cov yeeb nkab sealing, thiab kev sib txuas ua ke rau cov txheej txheem dej tsis zoo.

Cov txheej txheem ntau lawm nthuav tawm: Precision Txheej thiab Txheej Txheej Txheej Txheej Txheej Txheem

Copper Foil xaiv thiab kho:

Rolled Copper Foil: Kev ua tau zoo heev, haum rau kev rov kho dua daim ntawv thov.

Electrolytic Copper Foil: Tus nqi qis dua, qhov kev ntxhib los mos ua kom yooj yim adhesion.

Qhov saum npoo tuaj yeem oxidized (reddened, blackened) los yog coated nrog anti{0}} oxidation txheej los txhim kho lub sij hawm ntev -.

Conductive Adhesive Technology:

Conductive Adhesive: Sau nrog nyiaj, tooj liab, npib tsib xee, los yog carbon-raws li conductive particles kom ua tau "surface conductivity" thiab "Z-axis conductivity". Insulating Adhesive: Muaj lub zog dielectric siab thiab siv rau hauv cov ntawv thov uas xav tau hluav taws xob rwb thaiv tsev.

Cov nplaum nplaum tau ntawv pov thawj los ntawm UL, RoHS, thiab lwm yam qauv kom muaj kev nyab xeeb thiab kev tiv thaiv ib puag ncig.

Precision Txheej thiab Slitting: Hauv Chav Kawm 1000 chav huv, cov nplaum yog sib npaug siv siv lub taub hau txheej txheej, tswj cov nplaum txheej thickness kam rau ua nyob rau hauv ± 2μm. Siab-kev ceev slitting ces xyuas kom huv si, burr-dawb npoo.

Raws li ib tug kws tshaj lij daim kab xev chaw tsim tshuaj paus, peb tsis tsuas yog muab cov qauv specifications ntawmtooj liab foil daim kab xevtab sis kuj tseem muaj ib qho - nres kev hloov kho raws li koj qhov kev thov tshwj xeeb, los ntawm kev xaiv cov khoom siv thiab cov qauv tsim kom raug tuag- txiav. Yog tias koj xav tau daim ntawv teev cov ntaub ntawv los yog cov qauv kuaj, thov hu rau peb pab pawg engineering; peb yuav muab kev pabcuam kev pabcuam rau koj.